[Example] Utilization in optical fusion substrates
Support for the development of new optical electronics devices.
Supports waveguide layer configurations such as clad/core layers. Allows mixed design of optical waveguide wiring and electrical wiring (compatible with nano to millimeter wiring). Recognizes electrical connections for LSI chips, silicon photonics interposers, and hybrid circuit boards.
- Company:ファースト
- Price:Other